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It focuses on the various measurement methods available
The objective substrate range for the mask size defined by this Standard is 850 × 1
Such conditions are usually configuration specific
3-0298 (Withdrawn 1104) - replaced by SEMI E49
orgで，そして2009年11月にCD-ROMで入手可能となる。初版は2003年3月発行，前版は2003年7月に発行された。
M07000 - SEMI M70 - Test Method for Determining Wafer-Near-Edge Geometry Using Partial Wafer Site Flatness StdTpc-Molding Compounds It focuses on the variousWafer near edge geometry can significantly affect the yield of semiconductor device processing. Knowledge of near edge geometrical properties can help the producer and consumer to determine if the dimensional characteristics of a wafer satisfy given geometrical requirements. This Test Method is suitable quantifying the near edge geometry of wafers used in semiconductor device processing. The PSFQR or PSFQD metric is suitable for quantifying near edge
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